Specifications

 Set Overview & Components

1. Handles (2x): Features double-ended, non-slip metal handles (styled in a golden "hoop rod" / cudgel design) with precision cross-shaped chucks for secure blade locking.   
2. Blades (6x): Ultra-thin, flexible scraper and prying blades specifically shaped for delaminating CPUs, cutting black adhesive/underfill, and separating back glass.
3. Brushes (2x): Stiff-bristle cleaning heads for scrubbing away leftover flux, tin slag, and scraped adhesive.   
4. Primary Applications
5. Underfill & Glue Removal: Scrapes away epoxy and glue surrounding BGA chips and CPUs on mobile device motherboards.   
6. Chip Disassembly: Leverages ultra-thin blades to pry up IC chips without damaging delicate PCB pads.   
7. Back Cover Glass Removal: Cuts through adhesive seals when disassembling glass backings on smartphones.