Specifications

Key Features & Capabilities

1. Targeted Application: Designed for mainboard layer separation, lamination, CPU/IC glue removal, and camera desoldering on the iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max.  
2. Modular Preheating System: Uses a quick-swap magnetic base unit (MS1 base) that accepts interchangeable dedicated modules for various iPhone models and generic tasks (universal heating, Face ID, etc.).
3. Rapid & Uniform Heating: Reaches target temperatures rapidly with precise, even thermal distribution to avoid warping or damaging sensitive PCB components.  
4. Digital Temperature Control: Real-time LED digital display with custom temperature presets (typically 50°C–300°C), countdown timers, and automatic smart sleep modes.  

Usage Workflow

1. Snap the MS1-16 heating plate into the MS1 base unit host.
2. Place the iPhone 16 motherboard onto the precisely fitted contours of the plate.
3. Set your target temperature (e.g., ~180°C–200°C for middle-frame solder melting).
4. Allow the heat to loosen the solder joint, then safely separate the sandwich board layers using fine tweezers or scrapers without needing a hot air gun.