Specifications

Key Features

1. Target Compatibility: Specifically tailored for iPhone camera modules (iPhone 7 through 15 Pro Max) and general small SMD chips or flex cables.  
2. Dual-Bearing Rod Design: Features a double-rail sliding mechanism for increased stability during precision work.
3. Synthetic Stone & Aluminum Body: Built with high-temperature resistant, heat-insulating synthetic stone to withstand hot air guns and soldering irons safely.  
4. Versatile Clamping: Includes adjustable screws and fixed blue-bead tensioning to hold camera lenses, small logic boards, or IC chips securely without crushing fragile components.  

Primary Applications

1. Fixing out-of-focus camera modules, watermarks, or internal debris.  
2. Soldering camera flex cable connections and sensor board components.
3. IC chip degumming, micro-soldering, and BGA chip holding.