Specifications

Temperature Variants & Alloy Profiles

1. 138°C / 148°C (Low Temperature): Bismuth-based alloy (Sn-Bi) ideal for heat-sensitive ICs, CPU/GPU rework, double-decker logic boards, or components that risk warping under high heat.  
2. 183°C (Medium Temperature): Standard eutectic Sn63/Pb37 alloy formula providing high mechanical strength, excellent conductivity, and bright solder joints for general BGA reballing and chip replacement.  
3. 199°C / 217°C (High Temperature): Lead-free formulation used when high thermal resistance or original factory-spec lead-free compliance is required.

Key Specifications

1. Brand: 2UUL  
2. Series: Red Skull  
3. Packaging: 50g Airtight Jar / Pot  
4. Flux Type: Integrated rosin-based, no-clean, low-residue flux  
5. Consistency: Smooth, fine-grained Type 4 powder distribution for easy stencil scraping without bridging  

Primary Applications

1. BGA Reballing: Excellent stencil adhesion for uniform solder ball creation on baseband, power management (PMIC), and memory chips.  
2. Micro-soldering Rework: Smooth flow under hot air reflow with anti-collapse properties to prevent short circuits on fine-pitch components.

Storage & Usage Guidelines

1. Refrigeration: Store between 2°C and 10°C to prevent flux separation and maximize shelf life.  
2. Acclimation: Allow the container to rest sealed at room temperature (~25°C) for 1 to 2 hours before opening to prevent ambient moisture condensation.
3. Safety: Use active fume extraction and wear protective gloves when working with lead-containing variants (e.g., 183°C Sn63/Pb37).