Specifications

Key Specifications

1. Brand: MiJing (MJ)
2. Melting Point: 183°C
3. Composition: Sn63 / Pb37 (Tin-Lead eutectic alloy)
4. Packaging: 50g square-mouth tub (allows easy stencil scraping and minimal waste)
5. Particle Size: Type 4 fine powder for clean stencil passage
6. Flux Type: Integrated high-activity, no-clean rosin flux

Primary Applications

1. BGA Reballing: Ideal for CPUs, power management ICs (PMIC), basebands, and NAND flash chips requiring strong, uniform solder spheres.
2. Logic Board Repair: Standard medium-temp rework on iPhone and Android motherboards where high mechanical durability and low electrical resistance are required.
3. Component Rework: Suitable for surface-mount devices (SMD) and micro-connectors using a hot air station or preheater.

Storage & Usage Guidelines

1. Refrigeration: Store sealed between 2°C and 10°C to prevent flux separation and maintain smooth consistency.
2. Acclimation: Allow the tub to rest at room temperature (~25°C) naturally for 1 to 2 hours before opening to prevent moisture condensation and sputtering during reflow.
3. Safety: Contains lead; operate in a well-ventilated area with active fume extraction and wear protective gloves.