Specifications

Key Specifications

1. Brand: 2UUL
2. Model: BH21 (Glass Ox)
3. Base Material: High-density synthetic stone / tempered glass hybrid platform with a heavy stainless steel base for maximum stability.
4. Temperature Resistance: Heat-resistant up to 500°C+ to withstand direct hot-air station reflow without warping or expanding.
5. Clamping System: Precision sliding clamp mechanism with dual-axis or adjustable tension positioning for various motherboard shapes and small IC chips.

Primary Applications

1. Logic Board Holding: Securely clamps iPhone and Android motherboards during soldering, jumper wire installation, or component replacement.
2. Chip Degumming & Reballing: Prevents small ICs, CPUs, and power management chips from shifting while scraping underfill glue or applying hot air.
3. Double-Decker Motherboard Rework: Offers a flat, steady base for separating and joining layered PCBs.

Usage Tips

1. Avoid Over-tightening: Tighten clamps firmly enough to prevent component movement under hot air, but avoid excessive force on thin PCBs to prevent flexing.
2. Maintenance: Keep the sliding track clean of solder flux buildup, solder balls, and glue debris to maintain smooth clamping operation.