Specifications

Key Features

1. Dual-Head Functionality: Features distinct bristle configurations at each end to allow quick switching between broad sweep-cleaning and fine-spot scrubbing.
2. Anti-Static (ESD-Safe): Made with anti-static materials and stiff natural hog/boar bristles to safely clean sensitive logic boards without electrostatic discharge.

Varieties:

1. CL11 (Double Bristle): High-density hog bristles for general motherboard dust removal and clearing solder pads.
2. CL15 (Bristle + Fine Steel Wire): Combines stiff bristles on one end with ultra-fine steel wire on the other for scrubbing stubborn burnt flux and adhesive residue off IC chips.
3. Durable Handle: Equipped with a heat-resistant, non-slip metal or high-grade synthetic handle to withstand chemical solvents like Isopropyl Alcohol (IPA).

Primary Applications

1. Removing dried flux residue and solder paste from micro-soldering points.
2. Cleaning BGA pads, CPU chips, and stencil solder joints during reballing.
3. Clearing dust, corrosion, or liquid damage from smartphone logic boards.