Specifications

Key Features & Specifications

1. Material: Fine, high-purity oxygen-free copper braid for optimal thermal conductivity and fast capillary action.  
2. Pre-Fluxed: Coated with no-clean flux to ensure quick solder flow and minimize thermal stress on sensitive components.  
3. Common Widths: Typically available in 1.5mm, 2.0mm, 2.5mm, and 3.5mm (e.g., YCS 1515, YCS 2015, YCS 3520 models).
4. Applications: Ideal for cleaning BGA pads, removing excess solder bridges on surface-mount devices (SMD), and servicing mobile phone motherboards.  

How to Use

1. Trim any previously used, oxidized portion of the braid.
2. Place the fresh copper wick directly over the solder joint or pad.
3. Apply a heated soldering iron tip onto the wick for 1–2 seconds.
4. Lift the iron tip and the braid together once the melted tin absorbs into the wire.