Specifications

Key Specifications

1. Brand: RELIFE  
2. Composition: Sn63 / Pb37 (Lead-based tin-lead alloy)  
3. Melting Point: 183°C  
4. Particle Size: Type 4 (20–38 µm)  
5. Viscosity: 160–230 Pa·s  
6. Flux Type: No-clean (minimal, clear residue post-reflow)  
7. Common Packaging: 20g / 30g tubs or syringes  

Primary Applications

1. Smartphone and tablet logic board repair
2. BGA chip reballing and IC soldering  
3. Surface Mount Technology (SMT / SMD) board rework

Storage & Usage Tips

1. Refrigeration: Store between 2°C and 10°C to prevent flux separation and extend shelf life.
2. Warm-up: Allow the paste to return to room temperature (~25°C) naturally for at least 1–2 hours before opening to prevent moisture condensation.
3. Safety: Contains lead; use in a well-ventilated area with fume extraction and wear protective gloves.