Specifications

Key Specifications

1. Brand: YCS
2. Model: NB11 / NB-11
3. Material: Ultra-thin, high-hardness elastic alloy steel
4. Form Factor: Razor-sharp micro-curved blade tip designed to fit into standard universal craft knife handles or dedicated YCS scalpel holders.
5. Thickness: Super fine (~0.1mm) with high flexibility to slip under components without scraping PCB solder masks.

Primary Applications

1. Underfill & Glue Removal (Degumming): Used with a hot air station to scrape away epoxy resin, black adhesive, and underfill surrounding CPUs, basebands, and power ICs.
2. IC & BGA Prying: Gently slides beneath surface-mount chips during reflow to pry them off the board cleanly.
3. Logic Board Cleaning: Cleans residual thermal paste, glue remnants, and corrosion from tight spots on dense smartphone PCBs.

Usage Tips

1. Control Heat: Pre-heat the chip underfill to ~240°C–280°C with hot air before scraping to avoid lifting PCB pads.
2. Avoid Hard Force: Let the blade tip slide using gentle lateral scraping motions rather than pushing down into the board layer.