Mobile Phones & Tablets 
New Phones 
Second-Hand Phones 
Tablets 
Electronics 
Smart Watches & Accessories 
Fans 
Speakers & Audio 
LED Lights 
Alarm 
Microphone 
Ringlights 
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COOLERS 
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Life Style 
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Color
Capacity
Capacity not found.
Specifications
Key Features
- Compatibility: Supports iPhone models from iPhone X up to iPhone 16 Series (iPhone X/XS/XR/11/12/13/14/15/16 Pro Max).
- Magnetic Positioning: Features strong built-in magnets for quick, precise alignment between the motherboard base, stencil, and tin paste layer.
- Synthetic Stone Base: Built with high-temperature resistant, anti-warping synthetic material to prevent thermal damage or board flexing during heating.
- Precision Metal Stencils: Includes steel reballing stencils with square/rounded grid openings designed for accurate solder ball formation.
Main Applications
- Reballing the middle-frame soldering pads when splitting and recombining sandwich logic boards.
- Fixing motherboard sandwich separation issues, trace shorts, or layer connection faults caused by drops or thermal stress.
