Specifications

Key Features

1. Compatibility: Supports iPhone models from iPhone X up to iPhone 16 Series (iPhone X/XS/XR/11/12/13/14/15/16 Pro Max).
2. Magnetic Positioning: Features strong built-in magnets for quick, precise alignment between the motherboard base, stencil, and tin paste layer.
3. Synthetic Stone Base: Built with high-temperature resistant, anti-warping synthetic material to prevent thermal damage or board flexing during heating.
4. Precision Metal Stencils: Includes steel reballing stencils with square/rounded grid openings designed for accurate solder ball formation.

Main Applications

1. Reballing the middle-frame soldering pads when splitting and recombining sandwich logic boards.
2. Fixing motherboard sandwich separation issues, trace shorts, or layer connection faults caused by drops or thermal stress.