Specifications

Key Details

1. Compatibility: Supports sandwich/double-decker logic boards from iPhone 12 through iPhone 16 Pro Max (including 16e).
2. 5-in-1 Design: Uses 5 interchangeable magnetic positioning plates/slots to accommodate different board layouts across supported iPhone models.
3. Magnetic Alignment: Equipped with strong magnets to ensure accurate alignment between the base, logic board, and stencils during solder paste application.
4. Thermal Resistance: Built with high-temperature resistant, anti-warping synthetic stone/metal materials to keep boards flat during heating.

Primary Application

• Used for reballing interposer solder pads when splitting, repairing, and rejoining double-stacked iPhone logic boards.